2026 FOODEX Japan Application
2026 FOODEX Japan Application
Please be sure to complete the application form below and submit a check for the booth fee of $1,500.00 to participate in the Hawaiʻi Pavilion at FOODEX Japan 2026.
Important Dates:
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Application Deadline for FOODEX 2026: Friday, December 12, 2025
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Payment Due: Wednesday, December 24, 2025
Make check payable to: State of Hawaii/DBEDT
Mailing address:
- ATTN: Dennis Ling
- DBEDT/Business Development and Support Division
- P.O. Box 2359
- Honolulu, HI 96804
DEADLING TO APPLY FOR FOODEX 2026: Friday, December 12, 2025
PAYMENT DUE NO LATER THAN: Wednesday, December 24, 2025